PAM XIAMEN offers Cr – Foil and Substrate.
Cr Metallic Substrate ( polycrystalline): 10×10 x 1.0 mm, 1 side polished-1
Polycrystal Cr ( Chromium ) metallic substrate
Purity: > 99.99%
Substrate dimension: 10×10 x 1.0 mm,
Surface finish: one side polished
Atomic Number: 24
Atomic Mass: 58.9332 amu
Density: 7.19 g/cm3
Melting Point: 2180 K (1907 °C, 3465 °F)
Boiling Point: 2944 K (2671 °C, 4840 °F)
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, range from the first generation Germanium wafer, second generation Gallium Arsenide with substrate growth and epitaxy on III-V silicon doped n-type semiconductor materials based on Ga, Al, In, As and P grown by MBE or MOCVD, to the third generation: Silicon carbide and Gallium Nitride for LED and power device application.