PAM XIAMEN offers 3″ FZ Silicon Wafer Thickness：229-249μm.
3″ Si FZ
RRG ≤ 7%
about 1.5mil is etched from the surfaces in order to remove any surface damage
1.5mil = 1.5*25.4= 38.1μm
1.1 Wafers are to be cut from phosphorus doped N -Type Float Zone refined Silicon Rod.
1.2 Wafer Surface Finish (Front and Back):Acid etched to a bright finish with no pltting or faceting due to preferential etching on silicon crystalline planes.
1.3 Wafer syrface sgakk be iruebted no more than 2° off the 111 crystal plane.
1.4 Wafer must be edge rounded and have a single flat 1.00±0.25 inches wide.
1.5 Resistivity,radial gradient of resistivity and carrier lifertime messurement per applicable ASTM standard.
1.6 Resistivity range is all inclusive of variations due to radial gradient,striations,etc. from the center to within 0.0197 inches (0.5mm) from edge.
1.7 No lineage or other crystal defects permitted.
Found in 1990, Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer.
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