PAM-XIAMEN offers (20-2-1) Plane U-GaN Freestanding GaN Substrate
Item
PAM-FS-GAN(20-2-1)-U
Dimension
5 x 10 mm2 or 5 x 20 mm2
Thickness
380+/-50um
Orientation
(20-21)/(20-2-1) plane off angle toward A-axis 0 ±0.5°
(20-21)/(20-2-1) plane off angle toward C-axis -1 ±0.2°
Conduction Type
N-type / Undoped
Resistivity (300K)
< 0.1 Ω·cm
TTV
≤ 10 µm
BOW
BOW ≤ 10 µm
Surface Roughness:
Front side: Ra<0.2nm, epi-ready;
Back side: Fine Ground or polished.
Dislocation Density
≤5 x 106 cm-2
Macro Defect Density
0 cm-2
Useable Area
> 90% (edge exclusion)
Package
each in single wafer container, under nitrogen atmosphere, packed in class 100 clean room
For more information, please contact us email at victorchan@powerwaywafer.com and powerwaymaterial@gmail.com
2020-09-02meta-author
PAM XIAMEN offers Si+SiO2+Pt Thin Film.
Si+SiO2+Pt Thin Film
SiO2+Pt thin film on Si (B-doped)substrate ,10x10x0.5mm,1sp (SiO2=500nm, Pt=60nm)
Silicon Wafer Specifications:
Conductive type: SiO2+Pt thin film on Si (B-doped, (100)Ori.) substrate ,10x10x0.5mm,1sp( SiO2=500nm,Pt=60nm)
Resistivity: [...]
2019-05-16meta-author
2″ Free Standing Gallium Nitride (GaN) Substrate
PAM-XIAMEN,a leading supplier of GaN serie,is pleased to announce n+ c-plane 2″ SIZE Free standing gallium nitride (GaN) substrate with low Marco Defect Density <=2cm-2 are on mass production. (more…)
2012-03-06meta-author
InP epitaxial wafers with solar cell structure that a p-InGaAs lattice matched to n-InP substrate can be provided by PAM-XIAMEN. Indium phosphide is one of the main group III-V compound semiconductors for manufacturing multi-compound solar cells. These multi-compound solar cells mainly include GaAs, InP, [...]
2021-11-19meta-author
Indium arsenide (InAs) single crystal is available with S doped, Zn doped, Sn doped and undoped conductivity types in various orientations and sizes. InAs is a compound semiconductor material that is difficult to purify. Indium arsenide single crystal growth can be processed by LEC [...]
2019-03-12meta-author
PAM XIAMEN offers 3″ Si wafer Thickness: 380±20μm.
3″ Si wafer with Thermal Oxide of thickness 1000A
Diameter: 3″
Diameter: 76.2±0.3mm
Thickness: 380±20μm
Orientation: <100>±1°
Type/dopant: N type/Phosphorus
Resistivity: 1-20Ωcm
Polishing: SSP
Primary Flat 22.5±2.5mm, (110)±1°
Surface roughness: <5A
For more information, please visit [...]
2019-08-22meta-author