News

InGaN epi-wafers

InGaN (Indium Gallium Nitride) epi-wafer with MQWs is provided, which is a light-emitting layer for fabricating blue or green LED. Indium gallium nitride is a mix material of gallium nitride and indium nitride and often grown on GaN buffer on sapphire, silicon or SiC substrate. Researches carried out by PAM-XIAMEN, a GaN [...]

Transmittance of Glass Wafer

Transmittance of Glass Wafer Different Glass wafer material has different transmittance. The end user should check their detail application, and then choose corresponding glass wafer material, see below:   Transmission Rate of Jgs1 Glass Wafer Transmission Rate of Jgs1 Glass Wafer                             Transmittance of Glass Wafer           Transmission Rate of Jgs2 Glass Wafer: Transmission Rate of Jgs2 [...]

1470 / 1550nm High Power Laser Single Chip

1470 / 1550nm High Power Laser Single Chip PAM XIAMEN offers 1470 / 1550nm high power laser single chip as follows: Option1:1.5w: Item Parameters wavelength 1470/1550nm power 1.5 W Working current 4 A Working voltage 1.4 V Strip width 96 μm size 1000*500*150 μm Divergence angle 11/31 degrees Photoelectric conversion efficiency 26%   Option2: 3w: Item Parameters wavelength 1470/1550nm power 3 W Working current 9A Working voltage 1.5V Strip width 96 μm size 2000*500*150 μm Divergence angle 11/28 degrees Photoelectric conversion efficiency 21.3%   1470 / 1550nm High Power [...]

6″CZ Prime Silicon Wafer-3

6″CZ Prime Silicon Wafer-3 PAM XIAMEN offers 6″CZ Prime Silicon Wafer with orientation (111) In materials science, when discussing the growth of crystals, the position of atoms in crystals, the direction of atomic rows and the plane of atoms are often involved. We call the crystal orientation the orientation of each [...]

8″CZ Prime Silicon Wafer-1

PAM XIAMEN offers 8″CZ Prime Silicon Wafer With Notch It will be carried out after the silicon ingot is made. A flat angle is cut on the silicon ingot below 200 mm, which is called flat. In order to reduce waste, only a small round hole is cut on 200 mm [...]

2″ FZ Si wafer with SSP

PAM XIAMEN offers 2″ FZ Si wafer with SSP 2″ Undoped Silicon Wafer Diameter: 50.8mm Thickness: 300um Polished : Single Side Polished Orientation:  <100> Resistivity >10,000Ωcm For more information, send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com

6″ CZ Si Wafer

PAM XIAMEN offers 6″CZ Si Wafer with low LPD Wafer Si CZ (100) Dia 6” x Thickness 675µm Type p doped B Resistivity 1-20 ohm.cm With one flat One Side Polished or Double Side Polished LPD’s < 50 @ 0.2um TTV < 25µm Bow < 60µm Warp < 60µm Absorption coefficient of DSP silicon substrate changes with the wavelength: For more [...]

4″CZ Prime Silicon wafer-14

PAM XIAMEN offers 4″CZ Prime Silicon wafer-14 Silicon wafer dia 4 inch  thickness 500 um P type  boron doped or N doped resistivity 1-10 ohm cm orientation 100 For more information, send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com

2″CZ Prime Silicon Wafer-3

PAM XIAMEN offers 2″CZ Prime Silicon Wafer-3 Silicon wafer dia 2 inch thickness 280 um P type boron doped or N doped resistivity- 1-10 ohm cm orientation-100 For more information, send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com

8″ Silicon Wafer As-cut

PAM XIAMEN offers 8″Silicon As-cut Wafer According to the production process, silicon wafers can be divided into as-cut wafer, lapped wafer, etched wafer and polished wafer.The first process of silicon wafer processing is orientation, roll grinding and square cutting. Silicon single crystal directional cutting can be divided into: multi wire [...]